• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a circuit arrangement (1) comprising a printed circuit board, at least one light source (3) attached to the printed circuit board (2), and at least one metallic heat conducting body (4), the light source (3) and the heat conducting body (4) being SMD components wherein the light source (3) has at least two contact surfaces (3 ') for contacting the printed circuit board (2) and the heat conducting body (4) has at least one contact surface (4') for contacting the printed circuit board (2), wherein the printed circuit board ( 2) to the at least two contact surfaces (3 ') of the light source (3) and to the at least one contact surface (4') of the Wärmeleitkörpers (4) corresponding contact surfaces (2 '), wherein at least one solder joint (5a) of the light source (3 ) with at least one solder joint (5b) of the heat conducting body (4) for the transfer of heat between the light source (3) and the heat conducting body (4) as a common solder joint (5ab) a is done.
    公开号:AT518872A4
    申请号:T50599/2016
    申请日:2016-07-06
    公开日:2018-02-15
    发明作者:Edlinger Erik
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    Assembly of thermally highly conductive components for heat spreading
    The invention relates to a circuit arrangement, comprising a printed circuit board, at least one light source fastened to the printed circuit board, and at least one metallic heat conducting body.
    In addition, the invention relates in particular to a lighting device having at least one circuit arrangement according to the invention and a headlight, in particular a motor vehicle headlight, comprising a circuit arrangement according to the invention and / or a lighting device according to the invention.
    In many application areas, not least in the automotive industry, ever higher heat inputs are achieved in electronic circuits due to increasing packing density and complexity. This leads to high PCB costs, since usually the use of FR4 substrates (a class of flame retardant and flame retardant composites consisting of epoxy resin and glass fiber fabric, which is often used as an electrically non-conductive substrate for electrical circuit boards) is insufficient. Switching to insulated metal substrate (IMS) circuit boards has often been required in applications with high thermal requirements, resulting in increased costs.
    It has been found that in applications where light sources are mounted on a printed circuit board, primarily the light sources generate the heat loss to the printed circuit board and therefore depending on the number of light sources only a single or a few hotspots, so places with greatly increased thermal stress, exist on such a circuit board. So far, it may have been necessary in such cases to use costly IMS printed circuit board material to dissipate the heat from the light sources.
    It is therefore an object of the invention to provide an alternative possibility with which the heat of the at least one light source can be distributed inexpensively and efficiently.
    This object is achieved with a circuit arrangement of the type mentioned, in which according to the invention the light source and the heat conducting body are designed as SMD component, wherein the light source has at least two contact surfaces for contacting the circuit board and the heat conducting body has at least one contact surface for contacting the circuit board, wherein the circuit board to the at least two contact surfaces of the light source and to the at least one contact surface of the Wärmeleitkörpers corresponding contact surfaces, wherein the at least two contact surfaces of the light source with the corresponding contact surfaces of the circuit board are connected by means of a respective solder joint, and the at least one contact surface of the Wärmeleitkörpers with the corresponding contact surface of the printed circuit board is connected by means of at least one solder joint, wherein at least one solder joint of the light source with at least one Lötv Connection of the heat conducting body for transmitting heat between the light source and the heat conducting body is designed as a common solder joint.
    The term "SMD" is a technical term in the field of electronics, namely an abbreviation of the English term "surface-mount device", in English: "surface-mounted component. These are components that can contact the surface of a circuit carrier or a printed circuit board by means of correspondingly arranged electrical contacts. The circuit carrier can be equipped with contacts corresponding to the electrical contacts of the SMD component, so that the SMD components can be fastened to the surface of the circuit carrier by means of soldered connections and can be electrically contacted. Likewise, individual contacts may be formed as purely thermal contact surfaces. It is also not absolutely necessary for the at least one contact surface of the SMD component, which contacts the common solder connection, to fulfill an electrical function. Although this may be provided, but is not required for the heat conduction to the heat-conducting body.
    By the term "common solder joint" is meant, with respect to the components A and B, a solder joint which extends continuously from contact of the components A through to contact of the component B. As a result, it is possible for heat to be transmitted continuously along the common Solder joint (ie within the solder) can be exchanged between the components A and B, so that the temperature differences between A and B can be effectively reduced The component A is, for example, a light source, in the component B, for example, the heat-conducting body. In addition, common solder connections between other components can also be provided.The provision of a common solder connection allows a transition-free heat transfer between the contact surfaces of the components involved.
    It has been found that with light sources, the area of the light-emitting surface can become particularly hot during operation of the light source. For optimized cooling of the light source and to avoid pronounced temperature peaks at the light source can therefore be provided that the light source has a light emitting surface, wherein the common solder joint detects at least that contact surface of the light source which is closest to the light emitting surface or the thermal dissipation provided pad corresponds to.
    In addition, it can be provided that the height of the common solder joint is at least 50 micrometers mm, the height being measured normal to the plane spanned by the printed circuit board.
    In particular, it can be provided that the heat-conducting body consists exclusively of aluminum, copper, silver, metallically coated carbon, metallically coated silicon or compounds thereof.
    In particular, it may be favorable if the heat-conducting body is electrically conductive. As a result, individual contacts of the circuit carrier can be connected to one another via the heat conducting body, which could simplify, for example, a printed circuit board layout by avoiding intersections of printed conductors.
    In order to connect the solder joint particularly stable to the circuit board and to further improve the thermal conductivity parallel to the solder joint, it can be provided that the circuit board has at least one of the common solder joint associated continuous contact surface extending from the light source to the heat conducting body and the Light source connects to the heat conducting body. The solder joint may be connected to the contact surface, which is formed for example as a copper surface.
    In addition, it can be provided that the printed circuit board has a plurality of separate contact surfaces, which contacts the heat conducting body by means of one or more solder joints, whereby the heat transfer can take place starting from different contact surfaces or towards different contact surfaces.
    Furthermore, it can be provided that the light source has a laser diode and / or an LED.
    It can be particularly favorable when the width b is at least 0.8 mm, the depth t is at least 1 mm and the height h is at least 0.3 mm.
    In particular, it can be provided that the heat-conducting body is cuboid, whereby a particularly efficient and low-attachable embodiment of the heat-conducting body is given.
    In addition, it can be provided that the printed circuit board has at least one via, wherein the at least one via is preferably filled with solder and is connected to the heat conducting body by means of a solder connection. It may be advantageous if the at least one via completely penetrates the printed circuit board. In particular, it can be provided that extends the at least one via starting from the common solder joint of the light source with the heat conducting body in the circuit board. In addition, it may be favorable if the at least one via is designed as a slot via in that the at least one via is designed as a channel penetrating the printed circuit board, wherein the channel extends at least 2 mm, preferably between 6 and 20 mm, along the plane the circuit board extends. Of course it is possible to provide more than one via. Thus, for example, two, three, four or more vias may be provided, which may be formed as a slot via or as a conventional via.
    For additional improvement of the thermal management of the circuit arrangement can be provided that the circuit arrangement has a further heat conducting body. In principle, any number of light sources and / or heat-conducting body can be provided. In the context of this disclosure, the term number is understood to mean, unless otherwise stated, a number which may be, for example, one, two, three, four or more, in particular six, eight, ten, twelve or more than twelve. In view of this disclosure, one of ordinary skill in the art will be able to select the number of respective elements according to the technical requirements.
    In particular, it can be provided that further heat-conducting body is connected to a further electrical contact of the light source by means of a common solder joint. Accordingly, the number of common solder joints can be chosen freely.
    It can also be provided that the circuit arrangement has a further heat-conducting body which is arranged on the side of the printed circuit board opposite the light source and is thermally connected to the light source side of the printed circuit board by means of at least one solder-filled via passing through the printed circuit board.
    In particular, it can be provided that the printed circuit board consists of FR-4 substrate or is designed as an IMS printed circuit board. A circuit arrangement according to the invention in which the printed circuit board is in the form of an IMS material, although cost-intensive, may, however, have a thermal management optimized to a particular extent.
    Further aspects of the invention relate to a lighting device having at least one circuit arrangement according to the invention and to a headlight, in particular a motor vehicle headlight, comprising a circuit arrangement according to the invention and / or a lighting device according to the invention. In addition, one aspect of the invention relates to a vehicle having a circuit arrangement according to the invention and / or a lighting device according to the invention and / or a headlight according to the invention.
    The invention is explained in more detail below with reference to exemplary and non-limiting embodiments, which are illustrated in the figures. It shows
    FIG. 1 shows a schematic representation of a first embodiment of the invention,
    FIG. 2 shows a schematic illustration of a second embodiment of the invention,
    FIG. 3 shows a schematic representation of a third embodiment of the invention,
    FIGS. 4 (a) to 4 (f) show different further possibilities for improving the thermal conductivity of a circuit arrangement.
    In the following figures, unless otherwise stated, like reference numerals designate like features.
    FIG. 1 discloses a circuit arrangement 1 comprising a printed circuit board 2, at least one light source 3 fastened to the printed circuit board 2 and at least one metallic heat conducting body 4. The light source 3 and the heat conducting body 4 are designed as SMD components, the light source 3 having at least two contact surfaces 3 'For contacting the circuit board 2 and the heat-conducting body 4 has at least one contact surface 4' for contacting the circuit board 2. In the present exemplary embodiment, the contact surface 4 'is formed on the entire underside of the heat conduction body 4 facing the printed circuit board 2. The printed circuit board 2 has contact surfaces 2 'which correspond to the at least two contact surfaces 3' of the light source 3 and to the at least one contact surface 4 'of the heat conducting body 4.
    The at least two contact surfaces 3 'of the light source 3 are connected to the corresponding contact surfaces 2' of the printed circuit board 2 by means of a respective solder joint 5a, wherein the at least one contact surface 4 'of the Wärmeleitkörpers 4 with the corresponding contact surface 2' of the printed circuit board 2 by means of at least one solder joint 5b is connected, wherein at least one solder joint 5a of the light source 3 with at least one solder joint 5b of the heat conducting body 4 for transmitting heat between the light source 3 and the heat conducting body 4 is designed as a common solder joint 5ab.
    This makes it possible, the heat, which is shown in the figures by arrows, from a contact surface 3 'of the light source 3 (in the present example, the right contact surface 3') within the common solder joint 5ab continuously toward the contact surface 4 'of the heat conducting 4 can be transferred. The solder joint 5ab typically has a height of at least 50 micrometers, whereby heat can be transferred from the light source to the heat conducting body 4 in a particularly effective manner. The heat-conducting body 4 may have improved heat dissipation via cooling fins.
    The light source 3 has a light-emitting surface 3 ", the common solder joint 5ab detecting at least that contact surface 3 'of the light source 3 closest to the light-emitting surface 3".
    The heat-conducting body 4 may consist, for example, of aluminum, copper, silver, tin, metallic coated carbon or silicon or compounds of the abovementioned materials. The use of copper is particularly advantageous because of its excellent thermal conductivity and its low thermal expansion coefficient.
    As can be seen in FIG. 1, opposite to the right-hand contact surface 3 'of the light source 3 on the printed circuit board 2, a contact surface 21 is formed, which extends as far as the heat-conducting body 4 and along it. The common solder joint 5ab can thus be formed over a particularly large area, wherein the common solder joint 5ab can be firmly connected to the contact surface 21. Alternatively, it can be provided that printed circuit board 2 has a plurality of mutually separate contact surfaces 21, which contacts the heat conducting body 4 by means of one or more solder joints 5b. If the heat conducting body 4 is designed to be electrically conductive, in addition to the heat distribution between the contact surfaces 21, an electrical connection of these contact surfaces 21 can be realized. As light sources 3, for example, laser diodes and / or LEDs can be used. The heat-conducting body 4 preferably has a width b between 3 mm and 20 mm, a height h between 0.3 mm and 2 mm and a depth t between 1 mm and 10 mm, the depth in the normal direction to the plane spanned by the width and height is measured. Preferably, the heat-conducting body 4 is cuboid, wherein the width b and depth t define the base of the cuboid and the height h corresponds to the height of the cuboid.
    FIG. 2 shows a schematic representation of a second embodiment of the invention in which, in contrast to the embodiment according to FIG. 1, two heat-conducting bodies 4 are provided which are arranged on opposite sides of the light source 3, wherein both heat-conducting bodies 4 each have a common solder joint 5ab with the light source 3 are connected. The heat distribution at the circuit arrangement 1 can thus be further improved.
    Figure 3 shows a schematic representation of a third embodiment of the invention, wherein in contrast to the aforementioned embodiments in the circuit board 2 each two the contact surfaces 3 'of the light source 3 associated via in the form of slot via 6 are formed. A slot via 6 is formed by a channel-like recess in the printed circuit board 2, which can also completely pass through the printed circuit board 2. In the present example, this recess extends in each case toward the heat-conducting body 4 and is set up to be connected or filled with the introduced solder when the common solder connection 5ab is applied. For this purpose, the inner walls of the channels may, for example, be coated with copper, so that the solder can efficiently fill the channels and can be drawn into the channels by capillary forces, whereby the channels can be completely filled with the solder. The slot vias 6 filled with the solder of the common solder connection 5ab allow a heat transfer into and through the interior of the printed circuit board 2, whereby measures for the thermal optimization of the circuit arrangement 1 can be provided, for example, also on the side opposite the light source 3, in order to achieve derive the printed circuit board 2 introduced heat to the outside. Thus, the slot via 6 on the light source 3 opposite side of the circuit board 2 could also contact other heat conduction body not shown in the figures. In the present example, the coating on the inner walls of the slot vias 6 on the opposite side of the circuit board 2 in a track contact surface 2 'over. Alternatively, however, could also be provided as an insulating layer or attached, for example, a heat sink and connected to the slot via.
    FIGS. 4 (a) to 4 (f) show different further possibilities for improving the thermal conductivity of a circuit arrangement 1 in each case in a front and a lateral sectional view of a heat conduction body 7 to be embedded in a printed circuit board 2 (not shown) the circuit board 2 are introduced. The heat-conducting bodies 7 may be, for example
    Copper body act, which are provided in the circuit board 2 openings or depressions are used, wherein the wells can be filled by means of solder by the heat conducting body 7 are firmly connected by means of a solder joint 8 with the circuit board 2. The side walls of the openings or recesses are preferably coated with copper to allow a firm connection of the solder with the opening or depression and an effective heat transfer. FIGS. 4a to 4f show different arrangements of this type and can be provided as an additional measure for optimizing the thermal management of the circuit arrangement 1, but presuppose a corresponding preparation of the circuit board 2, which may increase the cost of such a circuit board 2. In principle, these heat conducting bodies 7 which can be integrated into the printed circuit board can also be provided independently of the embodiments according to FIGS. 1 to 3. Thus, they do not presuppose the presence of heat conducting bodies 4 designed as SMD component according to FIGS. 1 to 3. In particular, it can be provided that the heat-conducting body 7 according to FIG. be contacted by slot vias, which in turn are associated with a surface-mounted heat conducting body 4 of FIG. 1 to 3 and a common solder joint 5ab.
    In general, it can be said that the metallic connection of solder with a heat-conducting body and a copper spreading surface underneath allows improved thermal coupling to be achieved by the heat-conducting body and a heat source, for example the light source 3. By providing common solder joints 5ab according to the invention, only the low thermal contact resistance of the solder has to be overcome. The thermal conductivity of copper is up to 401 W / mK, for aluminum, however, it is only up to 236 W / mK. In addition to this structure, a slot can be provided directly under the copper component for bodies with heat sinks, or the component can be soldered countersunk in the slot to allow direct heat transfer to the underside of the circuit board. The heat-conducting body 7 may itself be completely or partially covered with low-melting solder, whereby homogenous soldering is facilitated by providing a low-melting solder.
    Most skilled electronics technicians are aware of the high thermal conductivity of copper in solid form. It is used in high-power applications to spread the heat along the FR4 or IMS surfaces. However, each additional micron of copper is grown galvanically on a printed circuit board substrate and has the same thickness throughout the substrate. In addition to the increased price of the substrate in the case of fine-pitch structures, this leads to problems of the conductor track minimum distance due to the isotropic deposition method in the wet-chemical production process of the printed circuit board. It is therefore much cheaper and easier to provide the previously mentioned measures for improving the thermal conductivity.
    In view of this teaching, one skilled in the art will be able to arrive at other, not shown embodiments of the invention without inventive step. The invention is therefore not limited to the embodiments shown. Also, individual aspects of the invention or the embodiments can be picked up and combined with each other. Essential are the ideas underlying the invention, which can be performed by a person skilled in the knowledge of this description in a variety of ways and still remain maintained as such.
    权利要求:
    Claims (21)
    [1]
    claims
    1. Circuit arrangement (1) comprising - a printed circuit board, - at least one of the printed circuit board (2) fixed light source (3), and - at least one metallic heat conducting body (4), characterized in that the light source (3) and the heat conducting body (4 ) are designed as SMD components, wherein the light source (3) has at least two contact surfaces (3 ') for contacting the printed circuit board (2) and the heat conducting body (4) at least one contact surface (4') for contacting the printed circuit board (2) in which the printed circuit board (2) has contact surfaces (2 ') which correspond to the at least two contact surfaces (3') of the light source (3) and to the at least one contact surface (4 ') of the heat-conducting body (4), the at least two contact surfaces (3) 3 ') of the light source (3) with the corresponding contact surfaces (2') of the printed circuit board (2) are each connected by means of a solder joint (5a), and the at least one contact surface (4 ') of the Wärmeleitkörpers (4) with the corresponding contact surface (2 ') of the printed circuit board (2) is connected by means of at least one solder joint (5b), wherein at least one solder joint (5a) of the light source (3) with at least one solder joint (5b) of the Wärmeleitkörpers (4) for transmitting heat between the light source (3) and the heat conducting body (4) as a common solder joint (5ab) is executed.
    [2]
    2. Circuit arrangement (1) according to claim 1, wherein the light source (3) has a light-emitting surface (3 "), wherein the common solder joint (5ab) detects at least that contact surface (5a) of the light source (3) which is the light-emitting surface (3). 3 ") is closest.
    [3]
    3. Circuit arrangement (1) according to claim 1 or 2, wherein the height of the common solder joint (5ab) is at least 50 micrometers.
    [4]
    4. Circuit arrangement (1) according to one of claims 1 to 3, wherein the heat-conducting body (4) consists exclusively of aluminum, copper, silver, metallically coated carbon, metallically coated silicon or compounds of the aforementioned materials.
    [5]
    5. Circuit arrangement (1) according to one of the preceding claims, wherein the heat conducting body (4) is electrically conductive.
    [6]
    6. Circuit arrangement (1) according to one of the preceding claims, wherein the circuit board (2) at least one of the common solder joint (5ab) of the light source (3) with the heat-conducting body (4) associated continuous contact surface (2 '), extending from the Light source (3) extends up to the heat conducting body (4).
    [7]
    7. Circuit arrangement (1) according to one of the preceding claims, wherein the printed circuit board (2) a plurality of separate contact surfaces (2 ') which contacts the heat conducting body (4) by means of one or more solder joints (5ab, 5b).
    [8]
    8. Circuit arrangement (1) according to one of the preceding claims, wherein the light source (3) comprises a laser diode and / or an LED.
    [9]
    9. Circuit arrangement (1) according to one of the preceding claims, wherein the width b of the heat-conducting body (4) is at least 0.8 mm, the depth t is at least 1 mm and the height h is at least 0.3 mm.
    [10]
    10. Circuit arrangement (1) according to one of the preceding claims, wherein the heat-conducting body (4) is cuboidal.
    [11]
    11. Circuit arrangement (1) according to one of the preceding claims, wherein the circuit board (2) has at least one via (6), wherein the at least one via (6) is preferably filled with solder and connected by means of a solder connection to the heat conducting body (4) is.
    [12]
    12. Circuit arrangement (1) according to claim 11, wherein the at least one via (6) completely passes through the printed circuit board (2).
    [13]
    13. Circuit arrangement (1) according to claim 11 or 12, wherein the at least one via (6), starting from the common solder connection (5ab), which connects the light source (3) with the heat-conducting body (4), into the printed circuit board (2). extends.
    [14]
    14. Circuit arrangement (1) according to one of claims 11 to 13, wherein the at least one via (6) is designed as a slot via (6) by running the at least one via (6) as a circuit board (2) passing through channel is, wherein the channel extends at least 2 mm, preferably between 6 and 20 mm, along the plane of the circuit board (2).
    [15]
    15. Circuit arrangement (1) according to one of the preceding claims, wherein the circuit arrangement (1) has a further heat conducting body (4).
    [16]
    16. Circuit arrangement (1) according to one of the preceding claims, wherein a further heat conducting body (4) with a further electrical contact (3 ') of the light source (3) by means of a common solder joint (5ab) is connected.
    [17]
    17. Circuit arrangement (1) according to one of the preceding claims, wherein the circuit arrangement (1) has a further heat conducting body (4) which is arranged on the light source (3) opposite side of the printed circuit board (2) and by means of at least one of the printed circuit board ( 2) passing through solder-filled vias (6) with the side of the printed circuit board (2) on which the at least one light source (3) is arranged, is thermally connected.
    [18]
    18. Circuit arrangement (1) according to one of the preceding claims, wherein the printed circuit board (2) consists of FR-4 substrate or is formed as an IMS printed circuit board (2).
    [19]
    19. Lighting device with at least one circuit arrangement (1) according to one of the preceding claims.
    [20]
    20. Headlight, in particular motor vehicle headlight comprising a circuit arrangement (1) and / or a lighting device according to one of the preceding claims.
    [21]
    21. Vehicle with a circuit arrangement (1) and / or a lighting device and / or a headlamp according to one of the preceding claims.
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    同族专利:
    公开号 | 公开日
    EP3267501B1|2018-12-19|
    AT518872B1|2018-02-15|
    EP3267501A1|2018-01-10|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP0407957A1|1989-07-10|1991-01-16|Alcatel Business Systems|Heat sink device for components of the SMD type mounted on a printed curcuit board|
    EP1795951A1|2005-12-08|2007-06-13|TPO Displays Corp.|Cooling arrangement for an LED back-light in a liquid crystal display|
    DE102007062167A1|2007-12-21|2009-06-25|Robert Bosch Gmbh|power circuit|
    KR20100029543A|2008-09-08|2010-03-17|티더블유|Led module cooling method and led assembly module of one-side pcb used it|
    US20110155360A1|2009-12-29|2011-06-30|Kechuan Kevin Liu|Surface mount heat sink apparatus|
    KR100982450B1|2010-06-25|2010-09-16|박기주|Led illumination lamp|
    US6605778B2|2000-10-02|2003-08-12|Siemens Aktiengesellschaft|Circuit carrier, in particular printed circuit board|
    US7806574B2|2006-04-16|2010-10-05|Albeo Technologies, Inc.|Thermal management of LED-based lighting systems|
    RU2518198C2|2008-09-16|2014-06-10|Конинклейке Филипс Электроникс Н.В.|Light-emitting device|DE102018129405A1|2018-11-22|2020-05-28|Semikron Elektronik Gmbh & Co. Kg|Arrangement with a printed circuit board and a power semiconductor component to be cooled above it|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50599/2016A|AT518872B1|2016-07-06|2016-07-06|Assembly of thermally high-performance components for heat spreading|ATA50599/2016A| AT518872B1|2016-07-06|2016-07-06|Assembly of thermally high-performance components for heat spreading|
    EP17183329.6A| EP3267501B1|2016-07-06|2017-07-26|Mounting of thermally highly conductive components for heat dissipation|
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